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Technical Support Director — FTG Circuits
Gary has over 35 years’ experience in electronics packaging and has held senior operations, quality and engineering positions, most recently as executive director and cofounder of the IPC Designers Council. He chaired the IPC Technical Activities Executive Committee, provided DfM consulting services, and spearheaded IPC’s PWB Designer Certification Program. He was inducted into the IPC Hall of Fame in 2015.